For Ultrasonic  - Precoated tape should be positioned on top of substrate. A perimeter weld at least 1/8” wide should be used to
prevent peel delamination. Machine settings including pressure, weld, and dwell (hold time) should be varied according to weld patterns, materials utilized and bond strength desired.

For Dielectric (RF) - Precoated tape should be positioned on top of substrate (commonly vinyl). A perimeter weld at least 1/8” wide should be used to prevent peel delamination. Machine settings including energy level, preseal, seal, and cool times may vary
according to weld patterns and materials being used.

For Iron-On - Substrate (commonly fabric) should be positioned on top of pre-coated tape. Pass warmed iron over substrate
several times at incremental heat settings until adhesive softens onto substrate. Do not allow adhesive to contact hot iron surface. Allow to cool before hand peel testing.

超声波粘合 – 应当将预涂胶带置于底层上面。采用的最小粘合宽度应当为1/8英寸，以防剥落和分层。粘合机械的设定参数包括压力、粘合和固定（保持一段时间），以便满足不同粘合方式、不同粘合材料和不同粘合强度的要求。

电介质粘合 – 应当将预涂胶带置于底层（通常是乙烯）的上面。采用的最小粘合宽度应当为1/8英寸，以防剥落和分层。粘合机械的设定参数包括能量级别、预封时间、密封时间、冷却时间，以便满足不同粘合方式、不同粘合材料的要求。广州翻译

熨烫底层（通常是纤维）应当置于预涂胶带的上面，加热熨斗在底层上往返几次以提高温度，直到底层上的粘合剂软化。注意不要让粘合剂接触熨斗表面。冷却之后再用手检查分层情况。广州翻译公司